Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728245 | Semiconductor device and semiconductor package including penetration via structure | Jubin Seo, Kwangjin Moon, Kunsang Park, Sujeong Park, Jaewon Hwang | 2023-08-15 |
| 11600553 | Semiconductor device including through substrate vias and method of manufacturing the semiconductor device | Jaewon Hwang, Kwangjin Moon, Kunsang Park | 2023-03-07 |