Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810900 | Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packages | Eunsuk Jung, Hyoukyung Cho, Jinnam Kim, Hyungjun Jeon, Kwangjin Moon +1 more | 2023-11-07 |
| 11804419 | Semiconductor device | Kwangjin Moon, Hyungjun Jeon, Hyoukyung Cho | 2023-10-31 |
| 11798866 | Semiconductor device including via structures with undercut portions and semiconductor package including the same | Eunji Kim, Sungdong Cho, Kwangwuk Park, Sangjun Park, Daesuk Lee | 2023-10-24 |
| 11791137 | Apparatus for etching substrate bevel and semiconductor fabrication method using the same | Ho-Jin Lee, Dong-Chan Lim, Jinnam Kim, Kwangjin Moon | 2023-10-17 |
| 11694980 | Semiconductor stack and method for manufacturing the same | Hyungjun Jeon, Kwangjin Moon, Hyoukyung Cho | 2023-07-04 |
| 11664316 | Semiconductor devices having penetration vias with portions having decreasing widths | Jinnam Kim, Hyoukyung Cho, Taeseong Kim, Kwangjin Moon | 2023-05-30 |