Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848285 | Semiconductor chip including buried dielectric pattern at edge region, semiconductor package including the same, and method of fabricating the same | Youngmin Lee, Inyoung Lee, Sungdong Cho | 2023-12-19 |
| 11798866 | Semiconductor device including via structures with undercut portions and semiconductor package including the same | Eunji Kim, Sungdong Cho, Sangjun Park, Daesuk Lee, Hakseung Lee | 2023-10-24 |
| 11791242 | Semiconductor device | Youngmin Lee, Hyoungyol Mun, Inyoung Lee, Seokhwan Jeong, Sungdong Cho | 2023-10-17 |
| 11749614 | Through-silicon via (TSV) key for overlay measurement, and semiconductor device and semiconductor package including TSV key | Yongyeop Kim, Seil Oh, Eunji Kim, Jihak Yu | 2023-09-05 |
| 11735498 | Through via electrode and device isolation structure including oxide layer pattern and nitride layer pattern sequentially stacked on inner surface of trench | Youngmin Lee, Sungdong Cho, Eunji Kim, Hyoungyol Mun, Seokhwan Jeong | 2023-08-22 |