Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798866 | Semiconductor device including via structures with undercut portions and semiconductor package including the same | Eunji Kim, Sungdong Cho, Kwangwuk Park, Sangjun Park, Hakseung Lee | 2023-10-24 |