Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848285 | Semiconductor chip including buried dielectric pattern at edge region, semiconductor package including the same, and method of fabricating the same | Kwangwuk Park, Youngmin Lee, Inyoung Lee | 2023-12-19 |
| 11832184 | System and method for exchanging data or signals for vehicle | Donghwi Kim, Hakseong Kim, Min Su Song | 2023-11-28 |
| 11798866 | Semiconductor device including via structures with undercut portions and semiconductor package including the same | Eunji Kim, Kwangwuk Park, Sangjun Park, Daesuk Lee, Hakseung Lee | 2023-10-24 |
| 11791242 | Semiconductor device | Kwangwuk Park, Youngmin Lee, Hyoungyol Mun, Inyoung Lee, Seokhwan Jeong | 2023-10-17 |
| 11735498 | Through via electrode and device isolation structure including oxide layer pattern and nitride layer pattern sequentially stacked on inner surface of trench | Kwangwuk Park, Youngmin Lee, Eunji Kim, Hyoungyol Mun, Seokhwan Jeong | 2023-08-22 |
| 11705379 | Semiconductor packages | Chanho Lee, Won Keun Kim, Haeseok Park, Ilgeun Jung, Jinkuk Bae +1 more | 2023-07-18 |
| 11569171 | Semiconductor memory device including wiring contact plugs | Yonghyeok Son, Junwoo Lee | 2023-01-31 |