Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749614 | Through-silicon via (TSV) key for overlay measurement, and semiconductor device and semiconductor package including TSV key | Yongyeop Kim, Seil Oh, Eunji Kim, Kwangwuk Park | 2023-09-05 |