Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791211 | Semiconductor devices including through vias and methods of fabricating the same | Yi Koan Hong, Kwangjin Moon | 2023-10-17 |
| 11749586 | Semiconductor device including through via structure | Sonkwan HWANG, Hoonjoo Na, Kwangjin Moon, Hyungjun Jeon | 2023-09-05 |
| 11664316 | Semiconductor devices having penetration vias with portions having decreasing widths | Hakseung Lee, Jinnam Kim, Hyoukyung Cho, Kwangjin Moon | 2023-05-30 |
| 11626443 | Semiconductor device including through via, semiconductor package, and method of fabricating the same | Yi Koan Hong | 2023-04-11 |