Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728197 | Wafer to wafer bonding apparatus and wafer to wafer bonding method | Hoechul Kim, Seokho Kim, Taeyeong Kim, Hoonjoo Na | 2023-08-15 |
JP
Jaehyun PHEE
Overall (2023): #407,290 of 537,848Top 80%
1
Patents 2023