Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735537 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park +1 more | 2023-08-22 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2023-05-30 |
| 11651902 | Patterning of thin film capacitors in organic substrate packages | Rahul Jain, Andrew J. Brown, Prithwish Chatterjee, Lauren A. Link | 2023-05-16 |
| 11610706 | Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates | Prithwish Chatterjee, Rahul Jain, Kyu Oh Lee, Sheng Li, Andrew J. Brown +1 more | 2023-03-21 |
| 11557489 | Cavity structures in integrated circuit package supports | Rahul Jain, Junnan Zhao, Ji-Yong Park, Kyu Oh Lee, Cheng Xu | 2023-01-17 |
| 11552008 | Asymmetric cored integrated circuit package supports | Lauren A. Link, Andrew J. Brown, Prithwish Chatterjee, Ying Wang, Chong Zhang | 2023-01-10 |