Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823994 | Systems and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package | Jiun Hann Sir, Min Suet Lim | 2023-11-21 |
| 11699664 | Wrappable EMI shields | Tin Poay Chuah, Yew San Lim, Min Suet Lim | 2023-07-11 |
| 11699644 | Organic mold interconnects in shielded interconnects frames for integrated-circuit packages | Jiun Hann Sir, Poh Boon Khoo | 2023-07-11 |
| 11664317 | Reverse-bridge multi-die interconnect for integrated-circuit packages | Min Suet Lim, MD Altaf Hossain | 2023-05-30 |
| 11658127 | RFI free picture frame metal stiffener | Jiun Hann Sir, Khang Choong Yong, Boon Ping Koh, Wil Choon Song, Min Suet Lim | 2023-05-23 |
| 11658111 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Amruthavalli Pallavi Alur, Debendra Mallik | 2023-05-23 |
| 11652057 | Disaggregated die interconnection with on-silicon cavity bridge | Khang Choong Yong, Min Suet Lim, Robert L. Sankman, Telesphor Kamgaing, Wil Choon Song +1 more | 2023-05-16 |
| 11589460 | System in package dual connector | Tin Poay Chuah, Min Suet Lim, Chee Chun Yee, Yew San Lim | 2023-02-21 |
| 11587844 | Electronic device package on package (POP) | Jiun Hann Sir, Min Suet Lim, Xi Guo | 2023-02-21 |
| 11552403 | Slot antenna on a printed circuit board (PCB) | Min Suet Lim, Boon Ping Koh, Wil Choon Song, Khang Choong Yong | 2023-01-10 |