Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11758662 | Three dimensional foldable substrate with vertical side interface | Bok Eng Cheah, Jackson Chung Peng Kong | 2023-09-12 |
| 11699664 | Wrappable EMI shields | Eng Huat Goh, Yew San Lim, Min Suet Lim | 2023-07-11 |
| 11696409 | Vertical embedded component in a printed circuit board blind hole | Min Suet Lim, Hoay Tien Teoh, Mooi Ling Chang, Chin Lee Kuan | 2023-07-04 |
| 11589460 | System in package dual connector | Min Suet Lim, Chee Chun Yee, Yew San Lim, Eng Huat Goh | 2023-02-21 |
| 11556157 | Diagonal printed circuit boards systems | Min Suet Lim, Chee Chun Yee, Yew San Lim, Jeff Ku | 2023-01-17 |