Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749606 | Embedded bridge substrate having an integral device | Amit Jain, Sameer Shekhar, Kevin J. Doran, Dong-Ho Han | 2023-09-05 |
| 11696409 | Vertical embedded component in a printed circuit board blind hole | Tin Poay Chuah, Min Suet Lim, Hoay Tien Teoh, Mooi Ling Chang | 2023-07-04 |
| 11562963 | Stacked semiconductor package and method of forming the same | Bok Eng Cheah, Jackson Chung Peng Kong, Sameer Shekhar, Amit Jain | 2023-01-24 |
| 11557552 | 3D trench reference planes for integrated-circuit die packages | Jackson Chung Peng Kong, Bok Eng Cheah | 2023-01-17 |