Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749606 | Embedded bridge substrate having an integral device | Amit Jain, Chin Lee Kuan, Kevin J. Doran, Dong-Ho Han | 2023-09-05 |
| 11562963 | Stacked semiconductor package and method of forming the same | Chin Lee Kuan, Bok Eng Cheah, Jackson Chung Peng Kong, Amit Jain | 2023-01-24 |