Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11589460 | System in package dual connector | Tin Poay Chuah, Min Suet Lim, Yew San Lim, Eng Huat Goh | 2023-02-21 |
| 11556157 | Diagonal printed circuit boards systems | Min Suet Lim, Yew San Lim, Jeff Ku, Tin Poay Chuah | 2023-01-17 |