Issued Patents 2023
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621192 | Inorganic dies with organic interconnect layers and related structures | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan | 2023-04-04 |
| 11605603 | Microelectronic package with radio frequency (RF) chiplet | Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan +1 more | 2023-03-14 |
| 11605867 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Jeremy Ecton, Kristof Darmawikarta, Yonggang Li, Dilan Seneviratne | 2023-03-14 |