Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495469 | Method for processing substrates | Toru Hisamatsu, Yoshihide Kihara | 2022-11-08 |
| 11495468 | Etching method and etching apparatus | Takahiro Yokoyama, Maju TOMURA, Yoshihide Kihara | 2022-11-08 |
| 11488836 | Apparatus for substrate processing | Masahiro Tabata, Toru Hisamatsu, Sho Kumakura, Ryuichi Asako, Shinya Ishikawa | 2022-11-01 |
| 11476123 | Etching method, plasma processing apparatus, and substrate processing system | Takayuki Katsunuma, Yuta NAKANE, Shinya Ishikawa | 2022-10-18 |
| 11459655 | Plasma processing method and plasma processing apparatus | Michiko Nakaya, Toru Hisamatsu, Shinya Ishikawa, Sho Kumakura, Yoshihide Kihara | 2022-10-04 |
| 11355350 | Etching method, substrate processing apparatus, and substrate processing system | Shinya Ishikawa, Kenta ONO, Maju TOMURA | 2022-06-07 |
| 11328933 | Etching method, substrate processing apparatus, and substrate processing system | Shinya Ishikawa, Kenta ONO | 2022-05-10 |
| 11270889 | Etching method and etching apparatus | Maju TOMURA, Yoshihide Kihara | 2022-03-08 |
| 11264236 | Substrate processing method | Toru Hisamatsu, Takayuki Katsunuma, Shinya Ishikawa, Yoshihide Kihara | 2022-03-01 |