Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538677 | Systems and methods for depositing high density and high tensile stress films | Chuanxi Yang, Hang Yu, Yu-Chi Yang, Chuan Ying Wang, Allison Yau +2 more | 2022-12-27 |
| 11530482 | Faceplate having a curved surface | Shailendra Srivastava, Sai Susmita Addepalli, Nikhil Sudhindrarao Jorapur, Daemian Raj Benjamin Raj, Amit Kumar BANSAL +5 more | 2022-12-20 |
| 11515324 | 3D NAND structures with decreased pitch | Thomas Jongwan Kwon | 2022-11-29 |
| 11501993 | Semiconductor substrate supports with improved high temperature chucking | Jian Li, Juan Carlos Rocha-Alvarez, Zheng John Ye, Daemian Raj Benjamin Raj, Shailendra Srivastava +3 more | 2022-11-15 |
| 11365476 | Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3D NAND memory devices | Praket P. Jha, Allen Ko, Thomas Jongwan Kwon, Bok Hoen Kim, Byung Ho Kil +2 more | 2022-06-21 |
| 11339475 | Film stack overlay improvement | Deenesh Padhi, Daemian Raj Benjamin Raj, Kristopher Enslow, Wenjiao Wang, Masaki Ogata +8 more | 2022-05-24 |
| 11276569 | On stack overlay improvement for 3D NAND | Yongjing Lin, Tza-Jing Gung, Masaki Ogata, Yusheng Zhou, Deenesh Padhi +3 more | 2022-03-15 |