Issued Patents 2022
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11526103 | Image forming apparatus capable of suppressing image defect due to foreign matter | Satoru Motohashi, Nobuo Oshima, Akihisa Matsukawa, Katsuichi Abe, Takayuki Namiki | 2022-12-13 |
| 11517881 | Exhaust gas purification catalyst | Haruka Shimizu, Masaaki Inamura | 2022-12-06 |
| 11505932 | Water supply mechanism and flush toilet | Hideaki Kashimura | 2022-11-22 |
| 11488918 | Surface finishes with low rBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2022-11-01 |
| 11461938 | Ultrasonic imaging device and image processing device | Kazuhiro Yamanaka, Junichi Shiokawa, Tomofumi Nishiura | 2022-10-04 |
| 11458460 | Exhaust gas purification catalyst | Yuki Nagao, Tokuya WATANABE | 2022-10-04 |
| 11373951 | Via structures having tapered profiles for embedded interconnect bridge substrates | Jeremy Ecton, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh, Leonel Arana +2 more | 2022-06-28 |
| RE49057 | Position detection apparatus, droplet discharging apparatus, method for detecting position, and medium | Yasunari Harada, Jun Watanabe, Tetsuyoshi Nakata, Toshiaki Hosokawa, Shunsuke Shitaoka | 2022-05-03 |
| 11320176 | Thermoacoustic device with diaphragm structure | Tatsuma Kouchi, Tomoyuki Takei, Kunio OHARA, Osamu Ishikawa | 2022-05-03 |
| 11322444 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Robert Alan May, Sameer Paital, Bai Nie, Jesse C. Jones +1 more | 2022-05-03 |
| 11309834 | High-power terahertz oscillator | Masahiro Asada, Safumi Suzuki | 2022-04-19 |
| 11309239 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2022-04-19 |
| 11264239 | Polarization defined zero misalignment vias for semiconductor packaging | Aleksandar Aleksov, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta | 2022-03-01 |
| 11264346 | Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging | Kristof Darmawikarta, Sri Ranga Sai Boyapati, Robert Alan May | 2022-03-01 |
| 11264307 | Dual-damascene zero-misalignment-via process for semiconductor packaging | Aleksandar Aleksov, Robert Alan May, Kristof Darmawikarta, Changhua Liu, Chung Kwang Christopher Tan +2 more | 2022-03-01 |