Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11421316 | Methods and apparatus for controlling warpage in wafer level packaging processes | Prayudi Lianto, Mohamed Rafi, Muhammad Azim Bin Syed Sulaiman, Guan Huei See, Ang Yu Xin Kristy +2 more | 2022-08-23 |
| 11404318 | Methods of forming through-silicon vias in substrates for advanced packaging | Peng Suo, Ying Wang, Guan Huei See, Chang Bum Yong | 2022-08-02 |
| 11373803 | Method of forming a magnetic core on a substrate | Peng Suo, Yu Gu, Guan Huei See | 2022-06-28 |
| 11309278 | Methods for bonding substrates | Prayudi Lianto, Guan Huei See, Sriskantharajah Thirunavukarasu, Xundong Dai, Peter Khai Mum Fung | 2022-04-19 |
| 11302549 | Substrate vacuum transport and storage apparatus | Sriskantharajah Thirunavukarasu, Eng Sheng Peh, Srinivas D. Nemani, Avinash Avula, Ellie Yieh | 2022-04-12 |
| 11289387 | Methods and apparatus for backside via reveal processing | Prayudi Lianto, Sik Hin Chi, SHIH-CHAO HUNG, Pin Gian Gan, Ricardo Fujii Vinluan +10 more | 2022-03-29 |