Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342226 | Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process | Karthik Balakrishnan, Jungrae Park, Sriskantharajah Thirunavukarasu | 2022-05-24 |
| 11302549 | Substrate vacuum transport and storage apparatus | Sriskantharajah Thirunavukarasu, Srinivas D. Nemani, Arvind Sundarrajan, Avinash Avula, Ellie Yieh | 2022-04-12 |