Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11421316 | Methods and apparatus for controlling warpage in wafer level packaging processes | Prayudi Lianto, Mohamed Rafi, Muhammad Azim Bin Syed Sulaiman, Guan Huei See, Ang Yu Xin Kristy +2 more | 2022-08-23 |
| 11342226 | Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process | Karthik Balakrishnan, Jungrae Park, Eng Sheng Peh | 2022-05-24 |
| 11309278 | Methods for bonding substrates | Prayudi Lianto, Guan Huei See, Arvind Sundarrajan, Xundong Dai, Peter Khai Mum Fung | 2022-04-19 |
| 11302549 | Substrate vacuum transport and storage apparatus | Eng Sheng Peh, Srinivas D. Nemani, Arvind Sundarrajan, Avinash Avula, Ellie Yieh | 2022-04-12 |