Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342226 | Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process | Karthik Balakrishnan, Sriskantharajah Thirunavukarasu, Eng Sheng Peh | 2022-05-24 |
| 11217536 | Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process | Wei-Sheng Lei, Brad Eaton, James S. Papanu, Ajay Kumar | 2022-01-04 |