Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355394 | Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate breakthrough treatment | Wei-Sheng Lei, Ajay Kumar | 2022-06-07 |
| 11217536 | Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2022-01-04 |