Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217536 | Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2022-01-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217536 | Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2022-01-04 |