Issued Patents 2022
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476202 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-10-18 |
| 11421316 | Methods and apparatus for controlling warpage in wafer level packaging processes | Prayudi Lianto, Mohamed Rafi, Muhammad Azim Bin Syed Sulaiman, Ang Yu Xin Kristy, Karthik Elumalai +2 more | 2022-08-23 |
| 11417605 | Reconstituted substrate for radio frequency applications | Ramesh Chidambaram | 2022-08-16 |
| 11404318 | Methods of forming through-silicon vias in substrates for advanced packaging | Peng Suo, Ying Wang, Chang Bum Yong, Arvind Sundarrajan | 2022-08-02 |
| 11398433 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-07-26 |
| 11373803 | Method of forming a magnetic core on a substrate | Peng Suo, Yu Gu, Arvind Sundarrajan | 2022-06-28 |
| 11355358 | Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applications | Prayudi Lianto, Yu Gu | 2022-06-07 |
| 11342256 | Method of fine redistribution interconnect formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Prayudi Lianto, Vincent DiCaprio | 2022-05-24 |
| 11309278 | Methods for bonding substrates | Prayudi Lianto, Sriskantharajah Thirunavukarasu, Arvind Sundarrajan, Xundong Dai, Peter Khai Mum Fung | 2022-04-19 |
| 11289387 | Methods and apparatus for backside via reveal processing | Prayudi Lianto, Sik Hin Chi, SHIH-CHAO HUNG, Pin Gian Gan, Ricardo Fujii Vinluan +10 more | 2022-03-29 |
| 11264333 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-03-01 |