Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404318 | Methods of forming through-silicon vias in substrates for advanced packaging | Peng Suo, Ying Wang, Guan Huei See, Arvind Sundarrajan | 2022-08-02 |
CY
Chang Bum Yong
Overall (2022): #491,884 of 548,613Top 90%
1
Patents 2022