YW

Ying Wang

Applied Materials: 1 patents #678 of 1,508Top 45%
Overall (2022): #200,176 of 548,613Top 40%
1
Patents 2022

Issued Patents 2022

Patent #TitleCo-InventorsDate
11404318 Methods of forming through-silicon vias in substrates for advanced packaging Peng Suo, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan 2022-08-02