Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309278 | Methods for bonding substrates | Prayudi Lianto, Guan Huei See, Sriskantharajah Thirunavukarasu, Arvind Sundarrajan, Peter Khai Mum Fung | 2022-04-19 |
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Xundong Dai
Overall (2022): #205,934 of 548,613Top 40%
1
Patents 2022