Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11421316 | Methods and apparatus for controlling warpage in wafer level packaging processes | Mohamed Rafi, Muhammad Azim Bin Syed Sulaiman, Guan Huei See, Ang Yu Xin Kristy, Karthik Elumalai +2 more | 2022-08-23 |
| 11355358 | Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applications | Guan Huei See, Yu Gu | 2022-06-07 |
| 11342256 | Method of fine redistribution interconnect formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Guan Huei See, Vincent DiCaprio | 2022-05-24 |
| 11309278 | Methods for bonding substrates | Guan Huei See, Sriskantharajah Thirunavukarasu, Arvind Sundarrajan, Xundong Dai, Peter Khai Mum Fung | 2022-04-19 |
| 11289387 | Methods and apparatus for backside via reveal processing | Sik Hin Chi, SHIH-CHAO HUNG, Pin Gian Gan, Ricardo Fujii Vinluan, Gaurav Mehta +10 more | 2022-03-29 |