Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11421316 | Methods and apparatus for controlling warpage in wafer level packaging processes | Prayudi Lianto, Mohamed Rafi, Guan Huei See, Ang Yu Xin Kristy, Karthik Elumalai +2 more | 2022-08-23 |