Issued Patents 2022
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521935 | Package structure and fabrication methods | Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2022-12-06 |
| 11521937 | Package structures with built-in EMI shielding | Steven Verhaverbeke, Giback Park, Chintan Buch | 2022-12-06 |
| 11476202 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-10-18 |
| 11424137 | Drying process for high aspect ratio features | Roman Gouk, Steven Verhaverbeke, Jean Delmas | 2022-08-23 |
| 11400545 | Laser ablation for package fabrication | Kurtis Leschkies, Wei-Sheng Lei, Jeffrey L. Franklin, Jean Delmas, Giback Park +1 more | 2022-08-02 |
| 11398433 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-07-26 |
| 11388822 | Methods for improved polymer-copper adhesion | Tapash Chakraborty, Steven Verhaverbeke, Chintan Buch, Prerna Goradia, Giback Park +1 more | 2022-07-12 |
| 11367643 | Method for substrate registration and anchoring in inkjet printing | Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo +1 more | 2022-06-21 |
| 11362235 | Substrate structuring methods | Steven Verhaverbeke, Giback Park | 2022-06-14 |
| 11342256 | Method of fine redistribution interconnect formation for advanced packaging applications | Steven Verhaverbeke, Kyuil Cho, Prayudi Lianto, Guan Huei See, Vincent DiCaprio | 2022-05-24 |
| 11329003 | Anchoring dies using 3D printing to form reconstructed wafer | Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo +1 more | 2022-05-10 |
| 11322381 | Method for substrate registration and anchoring in inkjet printing | Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo +1 more | 2022-05-03 |
| 11281094 | Method for via formation by micro-imprinting | Roman Gouk, Giback Park, Kyuil Cho, Chintan Buch, Steven Verhaverbeke +1 more | 2022-03-22 |
| 11264331 | Package structure and fabrication methods | Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2022-03-01 |
| 11264333 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-03-01 |
| 11257790 | High connectivity device stacking | Kurtis Leschkies, Steven Verhaverbeke, Giback Park, Kyuil Cho, Jeffrey L. Franklin +1 more | 2022-02-22 |