Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521937 | Package structures with built-in EMI shielding | Steven Verhaverbeke, Han-Wen Chen, Giback Park | 2022-12-06 |
| 11454884 | Fluoropolymer stamp fabrication method | Roman Gouk, Jean Delmas, Steven Verhaverbeke | 2022-09-27 |
| 11388822 | Methods for improved polymer-copper adhesion | Tapash Chakraborty, Steven Verhaverbeke, Han-Wen Chen, Prerna Goradia, Giback Park +1 more | 2022-07-12 |
| 11315890 | Methods of forming microvias with reduced diameter | Roman Gouk, Steven Verhaverbeke | 2022-04-26 |
| 11281094 | Method for via formation by micro-imprinting | Roman Gouk, Giback Park, Kyuil Cho, Han-Wen Chen, Steven Verhaverbeke +1 more | 2022-03-22 |