| 11521937 |
Package structures with built-in EMI shielding |
Steven Verhaverbeke, Han-Wen Chen, Chintan Buch |
2022-12-06 |
| 11521935 |
Package structure and fabrication methods |
Han-Wen Chen, Steven Verhaverbeke, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more |
2022-12-06 |
| 11476202 |
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration |
Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more |
2022-10-18 |
| 11400545 |
Laser ablation for package fabrication |
Kurtis Leschkies, Wei-Sheng Lei, Jeffrey L. Franklin, Jean Delmas, Han-Wen Chen +1 more |
2022-08-02 |
| 11398433 |
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration |
Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more |
2022-07-26 |
| 11388822 |
Methods for improved polymer-copper adhesion |
Tapash Chakraborty, Steven Verhaverbeke, Han-Wen Chen, Chintan Buch, Prerna Goradia +1 more |
2022-07-12 |
| 11362235 |
Substrate structuring methods |
Han-Wen Chen, Steven Verhaverbeke |
2022-06-14 |
| 11281094 |
Method for via formation by micro-imprinting |
Roman Gouk, Kyuil Cho, Han-Wen Chen, Chintan Buch, Steven Verhaverbeke +1 more |
2022-03-22 |
| 11264333 |
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration |
Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more |
2022-03-01 |
| 11264331 |
Package structure and fabrication methods |
Han-Wen Chen, Steven Verhaverbeke, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more |
2022-03-01 |
| 11257790 |
High connectivity device stacking |
Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Jeffrey L. Franklin +1 more |
2022-02-22 |
