Issued Patents 2022
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521937 | Package structures with built-in EMI shielding | Han-Wen Chen, Giback Park, Chintan Buch | 2022-12-06 |
| 11521935 | Package structure and fabrication methods | Han-Wen Chen, Giback Park, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2022-12-06 |
| 11476202 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-10-18 |
| 11469113 | High pressure and high temperature anneal chamber | Jean Delmas, Kurtis Leschkies | 2022-10-11 |
| 11462417 | High pressure and high temperature anneal chamber | Jean Delmas, Kurtis Leschkies | 2022-10-04 |
| 11454884 | Fluoropolymer stamp fabrication method | Roman Gouk, Jean Delmas, Chintan Buch | 2022-09-27 |
| 11424137 | Drying process for high aspect ratio features | Roman Gouk, Han-Wen Chen, Jean Delmas | 2022-08-23 |
| 11400545 | Laser ablation for package fabrication | Kurtis Leschkies, Wei-Sheng Lei, Jeffrey L. Franklin, Jean Delmas, Han-Wen Chen +1 more | 2022-08-02 |
| 11398433 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-07-26 |
| 11388822 | Methods for improved polymer-copper adhesion | Tapash Chakraborty, Han-Wen Chen, Chintan Buch, Prerna Goradia, Giback Park +1 more | 2022-07-12 |
| 11362235 | Substrate structuring methods | Han-Wen Chen, Giback Park | 2022-06-14 |
| 11342256 | Method of fine redistribution interconnect formation for advanced packaging applications | Han-Wen Chen, Kyuil Cho, Prayudi Lianto, Guan Huei See, Vincent DiCaprio | 2022-05-24 |
| 11315890 | Methods of forming microvias with reduced diameter | Chintan Buch, Roman Gouk | 2022-04-26 |
| 11281094 | Method for via formation by micro-imprinting | Roman Gouk, Giback Park, Kyuil Cho, Han-Wen Chen, Chintan Buch +1 more | 2022-03-22 |
| 11264331 | Package structure and fabrication methods | Han-Wen Chen, Giback Park, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2022-03-01 |
| 11264333 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-03-01 |
| 11257790 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Giback Park, Kyuil Cho, Jeffrey L. Franklin +1 more | 2022-02-22 |
| 11232951 | Method and apparatus for laser drilling blind vias | Wei-Sheng Lei, Kurtis Leschkies, Roman Gouk, Visweswaren Sivaramakrishnan | 2022-01-25 |