Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367643 | Method for substrate registration and anchoring in inkjet printing | Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo, Kyuil Cho +1 more | 2022-06-21 |
| 11329003 | Anchoring dies using 3D printing to form reconstructed wafer | Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo, Kyuil Cho +1 more | 2022-05-10 |
| 11322381 | Method for substrate registration and anchoring in inkjet printing | Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo, Kyuil Cho +1 more | 2022-05-03 |
| 11239213 | In-situ curing of color conversion layer in recess | Yingdong Luo, Mingwei Zhu, Hou T. Ng, Sivapackia Ganapathiappan, Nag B. Patibandla | 2022-02-01 |