| 11524455 |
Removable unit for selective powder delivery for additive manufacturing |
Raanan Zehavi, Hou T. Ng, Ajey M. Joshi |
2022-12-13 |
| 11518097 |
Selective powder dispenser configurations for additive manufacturing |
Raanan Zehavi, Hou T. Ng, Ajey M. Joshi |
2022-12-06 |
| 11471999 |
Integrated abrasive polishing pads and manufacturing methods |
Ashavani Kumar, Ashwin CHOCKALINGAM, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu +6 more |
2022-10-18 |
| 11446740 |
Multiple sequential linear powder dispensers for additive manufacturing |
Christopher A. Rowland, Anantha K. Subramani, Kasiraman Krishnan, Kartik Ramaswamy, Thomas Brezoczky +5 more |
2022-09-20 |
| 11446788 |
Precursor formulations for polishing pads produced by an additive manufacturing process |
Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Ashwin CHOCKALINGAM +2 more |
2022-09-20 |
| 11437559 |
Method and apparatus for deposition of multilayer device with superconductive film |
Mingwei Zhu, Zihao Yang, Ludovic Godet, Yong Cao, Daniel Lee Diehl +1 more |
2022-09-06 |
| 11404612 |
LED device having blue photoluminescent material and red/green quantum dots |
Yingdong Luo, Lisong Xu, Sivapackia Ganapathiappan, Hou T. Ng, Byung Sung Kwak +1 more |
2022-08-02 |
| 11367643 |
Method for substrate registration and anchoring in inkjet printing |
Daihua Zhang, Hou T. Ng, Sivapackia Ganapathiappan, Yingdong Luo, Kyuil Cho +1 more |
2022-06-21 |
| 11329003 |
Anchoring dies using 3D printing to form reconstructed wafer |
Daihua Zhang, Hou T. Ng, Sivapackia Ganapathiappan, Yingdong Luo, Kyuil Cho +1 more |
2022-05-10 |
| 11322381 |
Method for substrate registration and anchoring in inkjet printing |
Daihua Zhang, Hou T. Ng, Sivapackia Ganapathiappan, Yingdong Luo, Kyuil Cho +1 more |
2022-05-03 |
| 11251226 |
Systems and methods for transfer of micro-devices |
Mingwei Zhu, Sivapackia Ganapathiappan, Boyi Fu, Hou T. Ng |
2022-02-15 |
| 11239213 |
In-situ curing of color conversion layer in recess |
Daihua Zhang, Yingdong Luo, Mingwei Zhu, Hou T. Ng, Sivapackia Ganapathiappan |
2022-02-01 |
