Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158603 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Jisun YANG, Seunghoon Yeon, Chajea Jo, Sang-Uk Han | 2021-10-26 |
| 11152416 | Semiconductor package including a redistribution line | Chajea Jo, Hyoeun Kim, Jongbo Shim, Sang-Uk Han | 2021-10-19 |
| 11069592 | Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure | Jong Bo Shim, Jang-woo Lee, Yung-Cheol Kong, Young Hoon Hyun | 2021-07-20 |
| 11018173 | Image sensor | Kyung Suk Oh | 2021-05-25 |
| 10978431 | Semiconductor package with connection substrate and method of manufacturing the same | Jongbo Shim, Chajea Jo, Sang-Uk Han | 2021-04-13 |
| 10971535 | Image sensor package | Jong Bo Shim, Sang-Uk Han, Cha-Jea Jo, Won-Il Lee | 2021-04-06 |
| 10923428 | Semiconductor package having second pad electrically connected through the interposer chip to the first pad | Kilsoo Kim, Jongbo Shim, Jangwoo Lee, Eunhee Jung | 2021-02-16 |