Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158603 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Ji Hwang Kim, Jisun YANG, Chajea Jo, Sang-Uk Han | 2021-10-26 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158603 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Ji Hwang Kim, Jisun YANG, Chajea Jo, Sang-Uk Han | 2021-10-26 |