Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158603 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Ji Hwang Kim, Jisun YANG, Seunghoon Yeon, Sang-Uk Han | 2021-10-26 |
| 11152416 | Semiconductor package including a redistribution line | Ji Hwang Kim, Hyoeun Kim, Jongbo Shim, Sang-Uk Han | 2021-10-19 |
| 10985152 | Semiconductor package | Jichul Kim, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park | 2021-04-20 |
| 10978431 | Semiconductor package with connection substrate and method of manufacturing the same | Jongbo Shim, Ji Hwang Kim, Sang-Uk Han | 2021-04-13 |