Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205604 | Semiconductor package including a thermal conductive layer and method of manufacturing the same | Woo Hyun Park, Eon Soo Jang, Young-Sang Cho | 2021-12-21 |
| 11107743 | Chip on film package and display device including the same | Seung-Tae Hwang, Kyung Suk Oh, Woon-bae Kim, Jae-Min Jung | 2021-08-31 |
| 11004760 | Chip structure operating method including heating elements to reduce temperature variation | Woo Hyun Park | 2021-05-11 |
| 10985152 | Semiconductor package | Jichul Kim, Chajea Jo, Sang-Uk Han, Kyoung Soon Cho, Woohyun Park | 2021-04-20 |
| 10937771 | Semiconductor packages | Jichul Kim, Hansung Ryu, KyongSoon Cho, Youngsang Cho, Yeo-Hoon Yoon | 2021-03-02 |