Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107783 | Wafer-level package including under bump metal layer | Hyung-Sun Jang | 2021-08-31 |
| 10937771 | Semiconductor packages | Jichul Kim, Jae Choon Kim, Hansung Ryu, KyongSoon Cho, Youngsang Cho | 2021-03-02 |