Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205604 | Semiconductor package including a thermal conductive layer and method of manufacturing the same | Jae Choon Kim, Woo Hyun Park, Young-Sang Cho | 2021-12-21 |
EJ
Eon Soo Jang
Overall (2021): #464,082 of 548,734Top 85%
1
Patents 2021