Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205604 | Semiconductor package including a thermal conductive layer and method of manufacturing the same | Jae Choon Kim, Woo Hyun Park, Eon Soo Jang | 2021-12-21 |
YC
Young-Sang Cho
Overall (2021): #200,979 of 548,734Top 40%
1
Patents 2021