Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205604 | Semiconductor package including a thermal conductive layer and method of manufacturing the same | Jae Choon Kim, Eon Soo Jang, Young-Sang Cho | 2021-12-21 |
| 11004760 | Chip structure operating method including heating elements to reduce temperature variation | Jae Choon Kim | 2021-05-11 |
| 10964618 | Semiconductor package and method of manufacturing the same | Jang-woo Lee, Kyung Suk Oh, Yung-Cheol Kong, Jong Bo Shim, Jae-myeong Cha | 2021-03-30 |