Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069592 | Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure | Ji Hwang Kim, Jang-woo Lee, Yung-Cheol Kong, Young Hoon Hyun | 2021-07-20 |
| 10971535 | Image sensor package | Ji Hwang Kim, Sang-Uk Han, Cha-Jea Jo, Won-Il Lee | 2021-04-06 |
| 10964618 | Semiconductor package and method of manufacturing the same | Jang-woo Lee, Kyung Suk Oh, Yung-Cheol Kong, Woo Hyun Park, Jae-myeong Cha | 2021-03-30 |