Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018026 | Interposer, semiconductor package, and method of fabricating interposer | Un-Byoung Kang, Tae-Je Cho, Hyuek Jae Lee | 2021-05-25 |
| 10991677 | Semiconductor package | Sun-kyoung Seo, Soo Hyun Ha | 2021-04-27 |
| 10971535 | Image sensor package | Ji Hwang Kim, Jong Bo Shim, Sang-Uk Han, Won-Il Lee | 2021-04-06 |