Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145626 | Semiconductor package | Ji Hwan Hwang, Ji Hoon Kim, Ji-Seok Hong, Tae Hun Kim | 2021-10-12 |
| 11088038 | Semiconductor package including test pad | Tae Hun Kim, Ji Hwan Hwang, Ji Hoon Kim, Ji-Seok Hong | 2021-08-10 |
| 11056432 | Semiconductor package | Ji Hoon Kim, Tae Hun Kim, Ji-Seok Hong, Ji Hwan Hwang | 2021-07-06 |
| 11018026 | Interposer, semiconductor package, and method of fabricating interposer | Un-Byoung Kang, Tae-Je Cho, Cha-Jea Jo | 2021-05-25 |
| 10886255 | Die stack structure, semiconductor package having the same and method of manufacturing the same | Ji-Seok Hong, Ji Hoon Kim, Tae Hun Kim, Ji Hwan Hwang | 2021-01-05 |