Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043441 | Fan-out semiconductor package | Doo Hwan Lee | 2021-06-22 |
| 11018026 | Interposer, semiconductor package, and method of fabricating interposer | Un-Byoung Kang, Hyuek Jae Lee, Cha-Jea Jo | 2021-05-25 |
| 10903170 | Substrate having embedded interconnect structure | Doo Hwan Lee, Yong Hoon Kim, Jin Won Lee | 2021-01-26 |