Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114364 | Semiconductor package | Hee Jeong Kim, Juhyun Lyu, Jongho Lee | 2021-09-07 |
| 11069541 | Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing same | Yeong Kwon Ko, Jun Yeong Heo | 2021-07-20 |
| 11018026 | Interposer, semiconductor package, and method of fabricating interposer | Tae-Je Cho, Hyuek Jae Lee, Cha-Jea Jo | 2021-05-25 |
| 10930613 | Semiconductor package having recessed adhesive layer between stacked chips | Sang-Sick Park, Tae Hong Min, Teak-Hoon Lee, Ji Hwan Hwang | 2021-02-23 |