Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018115 | Semiconductor package having a high reliability | Ji Hwan Hwang, Tae Hong Min, Geol Nam | 2021-05-25 |
| 10930613 | Semiconductor package having recessed adhesive layer between stacked chips | Un-Byoung Kang, Tae Hong Min, Teak-Hoon Lee, Ji Hwan Hwang | 2021-02-23 |